Manufacturing Capabilities
- 1 to 30 Layer’s Rigid PCB’s
- 1 to 10 Layer Flexible PCB’s
- Multilayer Rigid-Flexible PCB’s
- Aluminum backing PCB’s
- 24 hr to 5 days delivery on prototypes
- 5 days to 4 weeks delivery on production
- Copper thickness from ½ oz to 5 oz (max)
- Printed Circuit board thickness from 0.020” to 0.125”
- Minimum line width .003”
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- Minimum spacing .003”
- Min SMT pitch .005”
- Minimum hole size .006”
- Laser Hole .002”
- Controlled Impedance
- Hole to hole location +/- .001”
- Pad to pad annular ring (solder mask) per IPC spec
- Hole to pad annular ring (circuitry) per IPC spec
- NC routed dimension +/- .005”
- NC scored dimension +/- .010”
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NOTE: The above capabilities are for general manufacturing purposes. Whenever possible IPC Class 2 standard specifications apply.
Process Capabilities
- Materials: FR4, High TG FR4, RoHS FR4, CEM, Teflon, Aluminum Base, Polyimide, Ceramic
- Material Manufacturers: Kingboard, Nanya, Isola, Rogers, Arlon, Taconic, Metclad…
- Photo-plotting
- LPI technology Screen coat/ Imaging system for accurate mask registration
- Solder mask Colors available include: Green, Red, Blue, Black, White and Clear
- LEAD Hot air solder leveling SMOBC
- LEAD-FREE Hot Air leveling SMOBC (RoHS)
- Immersion Gold (ENIG)
- Immersion Silver
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- Immersion Tin
- Organic ( OSP )
- Soft Wire bondable Gold
- Hard Gold
- BURIED and BLIND Via’s
- Carbon Ink
- Electrical test 100 % fault verification (Clamshell, flying probe and net-list)
- Peelable solder mask (mask coverage on areas where no reflow required)
- Profiling, Routing, V-Score
- Panel form standard for Automated Assembly.
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t: 905 477 8790